Accuracy Design For The Pricision Alignment System Of Flip Chip Bonding

This paper introduces the Flip Chip Bonding process and the development of Flip Chipbonding equipment in home and abroad, and the precise alignment structure in equipment isintroduced in detailIn the process of accuracy research for precision alignment system, precision requirements areanalyzed and calculated based on the related parameters of infrared focal plane device provided bythe customer and the three grade standard in IPC-A-610D Acceptability of Electronic Assemblies.In order to improve the positioning precision of alignment system, we analyzes the error may causevarious aspects, including geometric error, motion error, environment etc. we comprehend details ofeach component of dimension chain in the alignment system, the error analysis of each componentis made.On the basis of alignment system structure, establish the geometric and kinematic error modelof the alignment system, the lower body array to describe the topological structure on the system, byusing homogeneous coordinate representation of geometric and motion error of typical multi-bodysystem, alignment system Structure and motion error relationship and alignment error equations areestablished by the kinematics of multi-body system.