Processing And Study Of Property Of Cu-Al Functionally Gradient Material Prepared By Powder Metallurgic Method

Copper/aluminum functionally graded material samples were prepared by powder overlay.Relative density experiment,metallography experiment,pattern observation and composition analysis with scanning electronic microscope,X-ray experiment,microhardness experiment,conductivity experiment were examined,in order to study the influence of different pressing stress,the first and the second sintering temperature on relative density, microhardness , conductivity and generating copper/aluminum intermetallic compound.It was found that the first sintering temperature was higher ,and relative density of sample got larger; types and quantity of copper/aluminum intermetallic compound increased as sintering temperature got higher;microhardness of sample was higher due to more copper/aluminum intermetallic compound;higher conductivity could be obtained when sintering temperature was just above copper/aluminum alloy eutectic point;the best processing was 6 layers, 500MPa first pressing stress, 560℃first sintering temperature, 565℃second sintering temperature.the sample prepared by it could obtain higher conductivity 38.4MS/m.