Study On Transmission Laser Bonding And Its Parallel Micro Manipulation

The current packing and bonding techniques of Micro-Electro-Mechanical Systems is analyzed in this paper. Basic analysis and research on a new bonding method, Transmission Laser bonding, in terms of theory, is done based on some experimental data in this paper. Some current problems of Transmission Laser bonding are analyzed and a theoretical calculation model of thermal process is built. The numerical result which shows the surface temperature and molten depth is got by applying FORTRAN program which is based on Gauss-Legendre formula. The numerical result accords with the experimental result very well and helps for an advanced research on the factors which affect the bonding strength and solving the problems in the bonding process.For the needs of micro manipulation and transmission Laser bonding, the current micro manipulators are analyzed and a 2-DOF parallel machine for micro manipulation is addressed. The 2-RRR machine is simply, and suits for the micro manipulation area which needs accurate movements. An analytical form of the forward and inverse kinematics is derived. The 2-RRR platform has four different branches of inverse kinematics and two of forward kinematics. Then singularity conditions of the 2-RRR parallel machine are derived. The workspace is also analyzed and an optimal design conclusion for the workspace is given.A model for the 2-DOF parallel platforms is built by Solid works, and the 2-DOF parallel platform is simulated by Adams. The inverse kinematics, forward kinematics, speed and acceleration are got. At last a model which used in Transmission Laser bonding technique is built and simulated.