Study On Technology And Speciality Of Soy Adhesive Particleboard

Presently the more commonly used resins in particleboard industry are UF, PF and MUF. However, these resins are derived from non-renewable oil resources, and will release toxic formaldehyde in its producing and using. So, there is much interest in developing environmental friendly bio-based adhesives in the particleboard. The main research contents and results were as the following.The DSC of soy adhesive proclaimed that the main soy adhesive thermal reaction accomplish below 160℃; The more high temperature, the more standstill points; the high temperature is advantageous of soy adhesive solidify.Through orthogonal experiment, the test results proclaimed that resin content have significant influence on the soy particleboard properties.The optimal physical and mechanical properties of particleboard was obtained with resin content 12%, hot-pressing temperature 180℃, hot-pressing time 8min, hot-pressing pressure 4MPa.The antimould is the best after the soy adhesive particleboard veneer, secondly painted surface with antimould-agent, finally joined the board, the effect of zinc borate and antimould-agent-x are better than TBQ-M and copper azole.The influence on the temperature changes of the corn process of the factors: if hot-pressing temperature or the mat moisture content increases during the rapidly rising temperature stage,the rate of increasing temperature will accelerate,the rate of acceleration in thin or low density board is very high. During the moisture vaporizing stage the time used to vaporize moisture can be shortened by increasing hot-pressing temperature or decreasing the mat moisture content.In thin or low density board this time period is short.The hot-pressing temperature have significant influence on the peel strength and the interfacial bonding strength, the most appropriate condition for veneer technics is: hot-pressing temperature 130℃, hot-pressing time 4min, hot-pressing pressure 1.2Mpa, glue spreading amount 200g/m~2.