| With the increasing demand in higher integration, in/out (I/O) count, power,calculating speed and the lead-free materials, the electronic products are developing towards further miniaturization and green. Silver-epoxy adhesive, as one kind of green and environmental protective interconnected materials, is widely used in electronic industry. In this dissertation, the bonding reliability of silver-epoxy adhesive under hygrothermal conditions and thermal cycling are investigated. The main contents of this dissertation are as following.In this paper, a silver-epoxy adhesive die-attachment for experiment was prepared. Various experiment conditions for optimal bonding strength of the die-attachment were investigated by shear-mode experiments. It shows that the effects of the heating rate and cooling speed of curing process are little for bonding strengths of the die-attachment; while the thickness of the adhesive and the materials of the bonding surface affect the bonding strengths of the die-attachment evidently.The effects of hygrothermal conditions on the bonding strengths of silver-epoxy adhesive die-attachment are investigated by macroscopical shear-mode experiments. It shows that with the increase of the hygrothermal aging time, the bonding strengths of die-attachment decrease. Additionally, it is found that the interfacial failure modes of die-attachment are more and more obvious with the hygrothermal aging.The effects of thermal cycling conditions on the bonding strengths of silver-epoxy adhesive die-attachment are investigated by macroscopical shear-mode experiments. It shows that with the increase of the temperature cycling number, the bonding strengths of die-attachment decrease but not much. And more, it is found that the interfacial failure modes of die-attachment are not obvious with the thermal cycling.
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