Design Of Computer Case Front Panel And Injection Mold Based On Concurrent Engineering

Concurrent Engineering (CE) is a new developing technology, which made no problem during manufacturing and assembling by taking the constraints related to manufacturing and assembling into consideration seriously in the design stage. CE made product design, process design and manufacture successful, which shortened the developing period, improved product quality, reduced development cost effectively and improved competitiveness in market. In this paper, concurrent engineering theory and its practical application in the injection mold were studied, taking the concurrent development of the front panel of 1U server case and the mold as an example.In this paper, the production, key technologies and implementation methods of CE were stated, pointed out the deficiency of the original serial development in injection molding and the implement feasibility of concurrent engineering in injection molding. Put forward the concurrent engineering implementation strategy, according to graphic theory and design structure matrix, the development process of injection product was planned and the organization model was reconstructed. The design for manufacturing (DFM) and design for assembly (DFA) of the DFX and CAX (CAD / CAE) technologies were focused in plastic produce development.In this paper, based on concurrent engineering for guiding ideology, summarized the injection product structure factors and plastic product design rules; adopted the top-down design method, combing with DFM and DFA ideology, put forward the simplified method of clip and cooling structure; using CAD software (Pro/E) independently to design three-dimensional model of the front panel, completed the product and injection molding development of 1U server case front panel. The judgments and feedbacks of design process and results were obtained from the CAE software (Moldflow), such as filling analysis determined the injection system and warpage analysis determined the cooling system. Taking warpage value as goal, using Taguchi experimental method, and combining with signal to noise ratio and variable analysis (ANOVA), analysed influence degrees of every process parameter to warpage product, obtained the best mold temperature, melt temperature, injection pressure, injection time. According to the mold design process and the analysis results, determined the mold parting line and designed the injection system, angel pin, and ejecting system and so on, finally designed mold structure of the front panel of 1U server case.In the end, the whole thesis was summarized, the main research results and conclusions were given, the shortcomings and further research in need were pointed out.