Evaporative Cooling Technology Used For Chip Cooling

As the development of manufactory technology and improvement of process, computer chips become integrate, smaller and high frequency. The power density and energy consumption increase consistently, but the heat distribution constraints the development of microelectronic equipments. So the requirements of cooling technology for the microelectronic chips increase to an unprecedented level. The research for new high-performance cooling technology becomes quite necessary.The paper introduced the mainstream cooling methods nowadays and their cooling effect, advantages, disadvantages and application environment. Meanwhile some new cooling technology at home and aboard and their relative research were mentioned.The great prospects of cooling technology in chips field attract people to research it. This paper analysis thermal problem of chips. By establishing control equations, meshing, setting the node temperature, iterative field and adding boundary condition to get the temperature values on the surface of the computer chips.The paper according to the capillary heat distribution theory, combined with principles of heat and mass transfer analysis the amount of the water and heat transferred by fibers. Then it discussed the characteristics of moisture fibers and explored a new type cooling technology. Although water is not latest media in this period, it is in low cost, easy to get and has high latent heat, which makes it still fist choice for scientists. As the people's sweat evaporation prototype, the paper used the evaporation method to cool the chip. By contract with the transitional water cooling method, the new type cooling technology used coolmax moisture fiber which has four unique grooves to absorb large quantity of water and transfer to the surface of chip. As the temperature increased, water absorbed the heat from chip and become gas. There is phase change during the process. And phase change need a lot of latent heat which can help cool the chip.Because of the need of the production process of the chips, the transistors concentrated in the center region of the chips, which result to heat concentrated. So the temperature distribution on the surface of the chips is higher in the middle and low in surrounded. Refer to this distribution, heating stripe, copper and aluminum alloy, insulation materials were used to make analog chips. The moisture fibers were planted in the silicone film and another ending were gathered to the transport bottle. Total they together make the experimental platform.By setting different conditions to research the effect and influence factors of the evaporative cooling method. The result indicated that the new cooling method has more obvious effect in reduce the temperature of the chip. The rate is faster and the cooling degree is larger than air cooling method. It can make chip work in a lower temperature condition. In the end, make air cooling and evaporative cooling together can further enhance the cooling effect.