Electronic ballasts are indispensable accessories for the normal start-up and stable working of fluorescent lamps, it is also an important way to conserve electricity for lighting. As energy and environmental issues become increasingly prominent, energy saving and reduction have become the common senses all over the world, thus it seems pretty urgent to develop electronic ballasts with high performance. The design in the paper is based on the project"Theoretical Research and Design of Key Technique for DC/AC in BCD Process"in the institute of CAD in Xidian University.The basic components and principle of electronic ballasts are proposed, as well as several topologies and control methods of electronic ballasts inverter circuit. In addition, operating characteristics of the output resonant network is analyzed in detail. By selecting the available system program and making the targets of the functions and performances of the circuit, the design of a self-oscillation half-bridge drive inverter controller XD3168 is presented. By using the HVIC compatible technology, the chip successfully integrated ordinary CMOS devices and high-voltage LDMOS devices on the same one, resulting in great reduction in weight,price and size,etc.It has the function of self oscillation, by changing the values of the external oscillation components, the oscillation frequency range is 20KHz~100KHz. To ensure the push-pull output of the power devices to work safely without the phenomenon of punch-through, it consists of typically 1.1μs dead time. In addition, the bootstrap diode is also internal integrated, making its integration further higher. Using advanced floating power supply means, it can bear high voltage of 600V. The circuit can be applied to high-frequency switching power supply and high-frequency electronic ballast. XD3168 can achieve the basic function of electronic ballasts together with the external devices, they can control the ignition and normal operation of the fluorescent lamp.The simulations of each corner have been completed by using Cadence with the high voltage of 600V 0.5μm BCD process. The corners are combinations of different MOS models, supply voltages and temperatures. The simulation results implicate that the designed chip meets the design specifications with high performance. |