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Research On High Power DC/Dc Modular Power Supply

Posted on:2005-05-13Degree:MasterType:Thesis
Country:ChinaCandidate:J Y ChenFull Text:PDF
GTID:2132360122475761Subject:Power electronics and electric drive
Abstract/Summary:PDF Full Text Request
The high-voltage dc electric system is the third aviation power supply. There are two kinds of secondary power supply in high-voltage dc electric system, one is DC/DC converter that converts 270VDC to 28VDC, the other is static converter that converts 270VDC to 115VAC/400Hz. The modularity of the second power supply is important to the power system's performance.The paper analyzes the key issues in the design of a high power modular power supply. A new three-dimensional package structures is introduced, and a prototype of 270VDC input, 28V/36ADC output is built in the lab. Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied. The size of the prototype is 60x95x23 (mm), and the weight is less than 1kg, and its full-load efficiency is 92%. The assembly process and experimental results are included in this paper.In order to increase the power density of the module, a three-dimensional FC-IPEM package structure is introduced. A half-bridge FC-IPEM module is built in the lab with BGA power devices and flip-chip technique. The assembly process is presented in this paper.
Keywords/Search Tags:Surface mounting technology, Planar transformer, Insulated metal substrate, Spike killer, Coefficient thermal expansion, Ball grid array, Flip-chip
PDF Full Text Request
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