A New Type Of The Magnetron Sputtering With A Magnet Under The Substrate

Shielding the magnetic field from the target and placing a magnet below the substrate, a new magnetron sputtering method is achieved. By such these arrangements, we found that it becomes easier even to sputter magnetic target. It is because of the little influence of the target magnetic character on the magnetic field. Meanwhile, there are some changes in the experimental process compared with RF sputtering without magnetic field. Such variations are found that due to applied magnetic field from the substrate. The aspect and brightness of the glow and the self-bias voltage for the target changes significantly. Further measurements for the deposited films indicate that the appearance and the deposition rate of the films also vary. After we simulate the magnetic field in such case with C program, these variations are owed to distributed change of magnetic field near the target surface and in the discharging space, which can influence the motion of charged particles in the plasma obviously. A detailed measurement showed apparent thickness gradient in the film plane, which is interpreted as the result of the motion of particles sputtered from the target in the special-distributed magnetic field. Besides of those, the pattern of the target is novel after the long time's erosion. There is no erosion ring on its surface, so we can use this method to improve the utilization rate greatly.