The Magnetic-field Analyses Of Rectangular Planar Target And The Simulation Of Film Thickness

Magnetron Sputtering has been developed as one of the most important technology in industrial coating, especially for large area deposition. The production should especially pay attention to such aspects as deposition rate, process stability, film thickness uniformity as well as the utilization rate of target materials which need the optimized design of whole system and target magnetic field design is the key, while films thickness distribution will effect the characteristics of the thin films, so researches in these fields will have important academic and practical values. What concrete experimental research work this paper done is as follows: On the basis of the existing ITO coating glass production line, in order to solve the problem of inhomogeneous erosion of the target and the low life of the target material, established the mathematical model of the target magnetic field distribution in rectangular planar magnetron through the scalar magnetic potential law, simplified the calculated region, simulated the magnetic field distribution with ANSYS finite element software, and systemically analyzed the influences of structure parameters on the magnetic field on target surface, including uniformity and intensity. At last, two modified structures were designed, and the experiments indicated the new structures, better than current one on both magnetic field intensity and uniformity. While the shunt structure, can avoid the anomalous sputtering in current target and then increase the target life relatively. Furthermore, the shunt structure can increase the width of erosion area and can avoid the cross-corner effect. The experiment confirmed this result.Based on the FJL560CI1 ultrahigh vacuum magnetron with ion beam union sputtering system, we presented a mold to simulate the film thickness distribution, and established the relationship between film thickness distribution and the target-substrate distance, thus the superior thin film uniformity could be achieved by adjusting target-substrate distance. According to the calculation and analysis we know that the target-substrate distance is a major factor which affects the thickness distribution of the deposited films. In the certain scope, film thickness uniformity has enhanced with increasing target-substrate distance.Ti thin film was made by DC sputtering, and detected with Elliptical polarization measurement. We discovered that the relative deviation of film thickness was reduced as increasing target-substrate distance. The computer simulated results showed good agreement...