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Numerical Analysis On Evaporator Heat Transfer Of Loop Thermosyphon By FLUENT Software

Posted on:2007-12-29Degree:MasterType:Thesis
Country:ChinaCandidate:L X WangFull Text:PDF
GTID:2132360185487771Subject:Engineering Thermal Physics
Abstract/Summary:PDF Full Text Request
The research of radiator for electronic cooling is regarded more and more because of its meeting demand for electronic component with high heating flux and ensuring its working within normal temperature range. However, the traditional single-phase radiator can not meet the demand of higher and higher heating flux. No capillary Loop thermosyphon machined easily and circulated by its own gravity is one of the most effective way to solve heating dissipation of electronic component with high flux via phase change heat transfer.It is a complicated nonliner two-phase liquid process in the evaporator. The problem can be solved by using the Mixture Model of Fluent software and programing UDF to make the state equation,boundary condition,physical parameter and math model combine. Morever, how to make these setting in the Fuent software is discussed in detail. The temperature results by computing and experimental means are compared to get that the temperature difference between them is 2-3 ℃, but the temperature changing tendency between them are alike,and the computing model and results can be accepted.The performance of evaporator of loop thermosyhon is simulated numerically and analyzed by fluent software. The parameter of heating power(l00W-140W), saturation temperature (40℃-70℃ ) height of water quantity (6mm-11mm) and different shape augmented surface is computed and the temperature field is achieved. The situation of temperature on electronic component surface is also achieved. Furthermore,The transient heating procedure in the evaporator is computed and the transient temperature fields are achieved. The computational data is dealed by using the BP net and parameter formula is gained by using liner regression.The result shows that the loop thermosyphon can meet the demand for heating dissipation of high fulx electronic component and can make it work under the critical temperature. The computing results and procedures provides theoretic help to the optimum design of evaporator.
Keywords/Search Tags:electronic component, loop thermosyphon, Fluent numerical simulation, tempratrure field, heating power
PDF Full Text Request
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