| Great progress on both architecture-structural adhesive and correlative strengtheningtechnology has been made in recent years, as is being payed more and more attentions to.However, the architecture-structural adhesive used in water at low temperature isundeveloped. The dissertation therefore centers on modifying epoxy resin, and aims atpreparing high-performance structural adhesive that can cure in water at low temperature.The paper consists of the following parts:(1) The preparation of new bisphenol F epoxy / episulfide resin. In this part we discuss the preparation method of bisphenol F epoxy / episulfide resin by KSGN and bisphenol F epoxy resin. We conclude that there are episulfide groups in the product by IR and NMR spectrum. Using analysis by DSC curves the bisphenol F epoxy / episulfide resin has property that can cure at low temperature. All results indicate that the bisphenol F epoxy / episulfide resin is a best kind of resin that can crosslink at low temperature. Additionally, it is of appropriate viscosity(4236mPa.s,25℃), and it improves adhesive strength at low temperature.(2) The preparation of architecture-structural adhesive that can cure in water at low temperature. By optimizing the auxiliary such as curing agent, flexibilizer, diluent, coupling agent and accelerator, the architecture-structural adhesive was finally obtained using the bisphenol F epoxy / episulfide resin, which has good proprities of processing, mechanics and adhesion. Under 25℃ temperature the viscosity of the adhesive is 1335mPa.s. After hardening 21d( 5℃) in water this adhesive can obtain the tensile strength of 46.5MPa, the compressive strength of 78.3MPa, the flexural strength of 58.0MPa, the tensile sheer strength of 19.7MPa, the modulus of elasticity of 2756MPa, the breaking elongation of 1.8%. Using this adhesive to joint steel and concrete the cohesional strength is 2.67MPa. All results indicate that this adhesive can be used to...
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