Research Of The Design Parameter Of UPVC Heating And Cooling Floor By Experimentation

The UPVC heating and cooling floor is a new-style equipment of radiant heating and cooling. It's different from the other radiant floor heating system.It takes the UPVC as the material and circulates the hot water in the winter and cold water in the summer inside floor board to exchange the heat.This equipment heating in the winter and drops the temperature of the rooms in the summer and decorates the rooms. climate cricumstance and temperature will have no effect on the construction.As a molding material of circulating water the setting of the floor is convenience shortcut and good looking as put together the common floor.The UPVC heating and cooling floor have a good many strongpoint but as a fire-new equipment it also exists some problems in the application.For instance there is no design parameter of thermodynamic and the compute of waterpower the application of the floor to the application in theproject.So this article studied design parameter such as the thermodynamic capability of heating and cooling and the compute of waterpower of the UPVC heating and cooling floor by the test on the ISO standard test-board for heating appliances under low temperature hot water.Firstly, this article studied heat quantity and the lost of the heat of the UPVC heating and cooling floor in some different conditions applying the method of the thermodynamic equity.Studied the limit value and the degree of the uniformity of the surface of the floor board and studied distributing of the air temperature upon of the floor board.Secondly, this article studied decalescence heat quantity of the UPVC heating and cooling floor in some different conditions and status of the dew condensation on the surface of the floor board.Lastly, this article studied the lost of the resistance,which is cinsist of the lost of the resistance along the rule of the floor board and the local lost of the resistance of the annectent jaws of the UPVC heating and cooling floor.