Research On Wafer Labeling Machine Control System Based On PLC

Wafer is important technical index in semiconductor manufacture. In order to facilitate the management of wafer after etching and cutting, most of semiconductor manufacturers would label some bar code with a certain order in the wafer, However, the traditional way is manual labeling; it is not only inefficient, but also occupied more space, more likely to cause secondary pollution label. Therefore research and development of a automation, simple structure, reliable operation of wafer automatic labeling-- machine has important practical value. This paper is in order to the research and development of automatic labeling-- machine, mainly the work accomplished as fellow:1. According to the mechanical movement of labeling, the labeling machine as a whole structural design, completed a labeling machine aerodynamic design.2. The labeling process on the wafer to do in-depth studies, completed the labeling machine control system design, application of keyence's KV-1000 Series PLC to achieve electrical design and control procedures can be achieved.3. In order to achieve high precision performance labeling machine, the paper improved the ordinary two-phase hybrid stepping motor of the closed-loop control method, the labeling of boxes of wafer stepper motor movements of the position control system analysis, and in accordance with location Servo System mathematical model designed PID controller and the fuzzy controller, and the Matlab Simulink environment to do the simulation analysis.4. Development of the PC and KV-1000 Series PLC communications program and realized the labeling process control integration.Above, as well as research results in the automatic labeling machine on the wafer by the actual verification, and it is application in Renesas semiconductor companies in Suzhou .