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Research On The Anti-high-overload Technology For Military Integrated Circuit

Posted on:2009-04-19Degree:MasterType:Thesis
Country:ChinaCandidate:J C JinFull Text:PDF
GTID:2178360245479551Subject:Weapons project
Abstract/Summary:PDF Full Text Request
In this paper, the anti-high-overload technology for military integrated circuit were researched based on the present technological level of the East China Institute of Photo-Electron IC, and according to the author's actual work. The specification for the design and manufacture of the anti-high-overload were made. The technology of the anti-high-overload in processing use was realized.First, the military demand and the present development trend in domestic and aboard for the integrated circuit anti-high-overload were introduced; Next, the multiplayer substrate processing technology of the punching in green sheet, printing, lamination and the substrate fire were made a deep study; the technology of reinforcement and protection in integrated circuit such as the chip devices, between the substrate and frame, between the substrate and lamp stand, between the cover plate and frame were also researched; the technology of the integral substrate/package and multi-chip module-ceramic were studied simultaneously. The contrastive test and measure adopting different methods of the processing technology, the reinforcement and protection, the potting condition were made, the total two package and inter potting were also made. Finally, a series of the design, processing and test methods for the military IC anti-high-overload in processing use including the package, layout design, multi-player substrate processing and devices assembling were introduced.The technology of the design and processing for military IC anti-high-overload was researched has some characteristics of the advance, innovation and the wide use. The ability level of the military IC anti-high-overload was improved reliably and effectively.
Keywords/Search Tags:substrate processing, assembling technology, reinforcement and protection, package technology, test and measure, technological flow, anti-high-overload
PDF Full Text Request
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