Study On Technology Of Vertical Interconnection Micro-Assembly

3D assembly technology, which is one of the most important fashions to realize the micromation of electron system, has such advantages as interconnection length shorter, plane area littler, and so on. Under the present experimental conditions, the practical study on technology of vertical interconnection micro-assembly has been done in this article. And corresponding configuration has been designed, samples have been made. The correlative technics of processing and the connectivity of vertical interconnection have been validated. Main works are introduced in details:1. The design of assembly configuration to realize the technics of vertical interconnection assembly is improved. Different vertical interconnections will be described in this paper, including their advantages and disadvantages. Thus, the method with several vertical interconnections combined is adopted in this paper, based on the demands of assembly configuration and experimental ability, and the substrate structure of packaging module is designed. The transfer layer is also discussed at last.2. The plan of packaging module based on substrate and samples is actualized. Based on fully investigating the process ability home, analyzing the material properties of LTCC and BUM, and the feasibility of technics, Printed Circuit Board (PCB) technology is adopted as the alternative scheme for substrate in present. And corresponding configuration is designed, samples are made.3. The practical jointing technics to realize the configuration of vertical interconnection micro-assembly is validated. Based on many experiments, several technical difficulties in the process of experiments are discussed and solved, including the design and facture of assistant instrument, the optical centering of images, the leaking and printing of soldering tin ointment, the establishing of proper temperature curve, the technologic steps of assembly, and so on.4. The testing experiment of packaging module is finished. For realizing the system of stacked cubic assembly and improving the success ratio of assembly experiment, the packaging module should be capable of working well before vertical interconnecting. Thus, based on the experimental conditions and the demands of test, the testing of electrical capability and reliability is done in the paper. And the testing of reliability includes electron microscope examination, temperature experiment and vibration experiment.