| Mold heating is an important part in liquid dip coating processing, and it consists of flame heating, electrical heating, infrared heating, etc. Due to the advantages such as penetrating ability, good efficiency, rate of heating and convenience of temperature controlling, infrared heating is applied to many engineering fields rapidly. As for a certain type of infrared heating oven, its heating efficiency is not high and the thermal distribution of the mold heated by it is not uniform. The low efficiency not only brings resource wasting, but also makes the environment of work place unpleasant. Thermal distribution nonuniformity makes the quality of some products poor. As a result, making thermal analysis of heating process, then raising some methods to improve efficiency and thermal uniformity, bring many benefits.In this paper, finite element software ANSYS is used to simulate the process that mold is heated by oven. Firstly, it is necessary to build the three-dimension model of the heating device and mold. Then we make analysis in CFX to get the temperature distribution of oven. At last, we can get the thermal distribution of the mold after being heated for a certain period of time by making steady-state and transient thermal state coupling analysis, thus providing basis for optimizing of heating oven.Considering heat transfer knowledge and finite element analysis result, the optimal program is provided by comparing several optimization programs. After verification, the improved heating equipment can increase the heating efficiency significantly and improve the mold thermal distribution uniformity to some extent, thus providing theoretical guidance for the actual production. |
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