Study On The Modified Bismaleimide-Triazine Resin And Its Composites

a series of novel modified bismaleimide-triazine (BT) resin and its composites were developed, which are made up of bisphenol A dicyanate ester(CE),4,4-bismaleimidodiphenyl methane(BMI),2,2’-diallybisphenol A(DBA), and diallyl isophthalate (DAIP). The processing characteristics of DAIP modified BT resins suitable for resin transfer molding (RTM) were researched. Besides, the proccessablity, mechanical properties, thermal properties and dielectric properties of modified BT castings and its glass fiber reinforced composites were discussed. The results show the problem of strong crystallinity, high viscosity, high melting-point and difficult solubility in acetone of unmodified BT resin were effectively solved. In a addition, the introduction of DAIP not only could improve flexural strength and glass transition temperature (Tg), but also could improve the touhgness and the dielectric properties of modified BT resin castings. In a addition, the introduction of DAIP can effectively reduce the viscosity of modified BT resins. Moreover, it can be found that the compatibility of DAIP and BT resin systems is excellent based on DMA curves. The dielectric constant (ε) of DAIP modified BT resins castings also have outstanding thermal stability. The modified BT composites which have excellent mechanical properties, low dielectric properties, high resistance of temperature have been widely used in the field of radome, high performance PCB and so on.