Study On Polishing Technology Of Engineering Ceramics Ultra-precise Plate

Engineering ceramics has high-intensity, high hardness, high-wearing feature and resistance to elevated temperature etc. eminent characteristics. Together with metal and complex material, they have been entitled as three big supports of modern engineering materials, however, because it is difficult to machine, it is largely limited to popularize and apply in high scientific and technical field.In allusion to engineering ceramics and ultrasonic wave characteristics, ultrasonic wave is applied to precision machining of engineering ceramics. In this paper, according to local resonance theory, the sound system has been designed and produced, which adapt to two-dimension ultrasonic polishing big plate. And vibration performances of the device have been putted to test; By means of indentation fracture mechanics, it studies on the removal mechanism of hard-brittle material, and analyses and simulates the mass point motion of sample and single grain trace under different machining conditions, and finds that when adding ultrasonic vibration in y-direction, the single grain traces are sinusoidal curves with a amplitude which is different to line traces of common polishing, which can show that two dimension ultrasonic polishing scratch marks of abrasive grains is wider than common polishing, thereby, high efficiency mechanism of two dimension ultrasonic polishing is proved; Through the polishing force experiment of engineering ceramics, it finds that ultrasonic polishing forces are less than common polishing under same machining conditions; Trough comparing polishing surface roughness, it analyses influences of different parameters on surface roughness. With orthogonal test and multivariate linear regression analysis, the significance levels of parameters on surface roughness are presented, the optimum polishing parameters of ultrasonic vibration polishing are put forward, and the experimental formula of surface roughness is gained; Through electron microscopic experiment, it discloses the essential distinction between grinding and polishing, and further explains that ultrasonic polishing surpasses common polishing. When ultrasonic polishing, material is removed by fine-crush mode, and pits in its surface are relatively shallower, and flat surface is relatively bigger. Trough experimental investigation, it can be proved that applying ultrasonic to polishing is a high efficiency method to engineering ceramics.