Research Of Cr Coatings On Inner Surface Of Cylinder Pepared By High Power Pulsed Magnetron Sputtering

Thin Films are widely used in industrial, medical, biological, military and other areas, devices work in special environments often requires the preparation of a thin film on the surface to meet the application requirements. This article prepare Cr coating on the inner surface of cylinder by the method of High power pulsed magnetron sputtering, and acquire the emission spectrum by the Fiber optic spectrometer and analyze with relative software, and analyze the discharge characteristics during the discharge process. And prepare the Cr films under different technology. Through the optical microscope, SEM, scratch tester, micro hardness tester and other testing methods, the microstructure and mechanical properties of the films were analyzedIn the spectrum diagnostic of high power pulsed and direct current magnetron sputtering, the spectral intensity of excited state Ar atoms is obviously high, while the spectral intensity of Cr is general, but in the high power pulsed magnetron sputtering, the spectral intensity greatly enhanced, the spectral intensity of Ar decreased significantly as well, proving that the metal ionization of HPPMS is much higher than that of DC magnetron sputtering. With the power increase, the overall spectral intensity significantly increases; with the upgrading of pressure, spectral intensity did not change signifi cantly.This paper studies the Cr target high-power pulsed magnetron sputtering discharge characteristics, found that as pressure increases from 0.2Pa t o 1.4Pa, pulse current first significantly increases but the increase rate dec reases, and pulse current remains stable at last; when the target voltage rises from 450 V to 650 V, pulse currents increased significantly and the increase rate is also growing; when the pulse frequencies rises from 20 Hz to 150 Hz, pulse current has no significant change, with only a small increase in the trend; when the pulse width increased from 50μs to 250μs, pulse current first increases rapidly, but as the width reaches 100μs,the pulse current basically remains stable. When the pulse width is 250μs, there is a clear current platform.With the improvement of the target voltage, the gas ion energy increases, Cr sputtering yield increases, so that the energy and the n umber of sputtered particles are increased, the deposition rate improved significantly. When the cylinder diameter increases, the sputtering rate significantly reduces, which dues to the increase of equivalent target base distance so sputtering particle energy decrea ses or be attracted back to the target. The effect of working pressure and substrate bias on film morphology and deposition rates is relatively complex.With the improvement of the target and the substrate bias voltage, interfacial adhesion of films are increased; when the cylinder diameter increases, adhesion strength also tended to increase; when working pressure increased, the adhesion strength declined. When the target voltage and the substrate bias gradually increased, the film micro-hardness values are both presented the trend of increase at first and then decrease.