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Study On Adhesives Connected Adsorbent And Adsorbent Bed

Posted on:2010-11-02Degree:MasterType:Thesis
Country:ChinaCandidate:Y YaoFull Text:PDF
GTID:2191360302977098Subject:Thermal Engineering
Abstract/Summary:PDF Full Text Request
Study on the influence to thermal contact resistance and connection reliability brought by connection mode, a new connection method be proposed. And the influence to thermal contact resistance and connection reliability bring by the new connection mode be studied. The main research results are as follows:1.A method that making curing adsorbent which shape is as same as the adsorbent bed heat transfer surface, and bonding it in adsorbent bed by adhesive be proposed.2.On the background that apply to adsorption refrigeration system driven by waste heat about 300℃, the author experiment on the thermal conductivity, intensity ,high temperature, great humidity, thermal fatigue, outgassing rate of five adhesive self made. The experiment results show that, the silicone rubber adhesive added nano-Sic is an ideal adhesive. It keep elastic after treatment by solidification, high temperature, water immersion, thermal fatigue, and it can keep considerable strength and adhesive ability after treatment by high temperature about 400℃. It can bond adsorbent and adsorbent bed firmly, at the same time, it can buffer thermal stress between adsorbent and adsorbent bed.3. By the experiment of the single-tube adsorption refrigeration test-bed, the influence to adsorption refrigeration system brought by bonding method be studied. The result show that: the method that bonding adsorbent and adsorbent bed by adhesive is feasible, and it can effectively reduce the thermal contact resistance between adsorbent and metal heat exchanger surface.4. The silicone rubber adhesive added nano-Sic has a outgassing rate in a vacuum environment, it do harm to adsorption refrigeration system. But it can be proved by experiment that this question can be solved by pregassing treatment.
Keywords/Search Tags:Adsorption refrigeration, adhesive, Bonding, Contact thermal resistance, Reliability
PDF Full Text Request
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