Microfluidic Control Chip Die Bonder Dual Variable Displacement Pump System Features

The technical of polymer injection has been used more and more abroad in the areas of automobile, medical, electronic and so on. The key technical which includes mold design and auomatic injection machine technical determines the development of the whole polymer injection domain.So there are many important meanings for the job of complicate mold design, and the analysis of the hydraulic system used in the automatic injection machine.This is just the purpose of the research work below:1) Based on the microfluidic chip injection molding technology, the article compared different design plans of complicate mold. Choosed the drive.system and the execute components for the in-mold boning process.2) Based on the dynamics simulation software named ansys11.0/ ls-dyna and combined with stress contact theory, the article analysized the friction force in the process of mold core moving and the limit contact force; Analysized the friction force in the process of the whole mold structure moving. Fitting the load curve in order to provide data for the hydraulic system analysis.3) Design the hydraulic core moving system integrated in the injection machine. Based on the common hydraulic system analysis software AMEsim7.0, the research built the model of double variable quatity pump which named AKP10 and RKP63. And the simulation testified the model from the pressure stability of the LS vavle,the quatity reaction property of the double pump, the relationship between the pressure and the quatity. The conclution showed that the model is correct to some extent. Then the research built the load model of injection, holding, plasticing, mold moving, gate breaking, core moving, and bonding. According to that, the simulation got the results of the variable curve of the pressure and the flow quatity, the kinematic curves of the load in order to testified the system property and the power property of the system.4) Finished the experiments of the microfluidic chip in-mold bonding under the environment of Arburg370s injection machine and the Ace mold. Successfully realized the microfluidic chip in-mold bonding. Meanwhile, based on the pressure sensor integrated in the injection machine and the SELOGICA control system, we got the variable curves for the pressure at the position of the outlet of the pump and the load force values during the whole process. Testified the response property of the hydraulic system.