Study Of Secondary Recrystallization Of Lower Temperature Grain-oriented Silicon Steel With Cu

Grain-oriented silicon steel is a kind of soft magnetic material that is widely used.At the present time, it is manufactured though conventional process.One of the difficulties in the production is the high heating temperature(1360-1380℃) before hot-rolling.Making a change in inhibiter and nitriding in subsequent process can be a good solution of this problem.Simulated to product grain-oriented Silicon Steel in the lab on the basis of investigation on lower temperature grain-oriented silicon steel including Copper. Analysing by TEM and the magnetic property is measured. Through these works some new rules and characters of new inhibitor and secondary recrystallization's mechanism.And main contents of this paper are as follows:(1) Cu enlarge the austenitic area, so reduce dissolve's temperature of AlN and restrain educt. The heating-up temperature is reduce from 1360 to 1240.Beacause nitriding and separateε-Cu in nitrriding anneal, can product perfect lower temperature grain-oriented silicon steel.(2) The educt most is AlN that core is sulfid and few sulfide what separate with AlN in hot-rolled sample.(3) Not only reversion but also nitriding and separateε-Cu in nitriding anneal.550℃is the proper finished product annealing temperature By comparison of different anneal technics,it is show that the protection atmosphere of dry N2+H2+NH3 is better than other atmosphere.(4) The secondary recrystallization's startup temperature is about 970℃. By comparison of different anneal technics, The best technics is that secondary temperature rise is 17℃/h and lower insulation work is more than 2 hours.