Of Microcrystal Glass And Aluminum Electrostatic Bonding Organizational Performance

Electrostatic bonding is an innovative technology static using electrostaticfield and thermal field to enhance the activation of molecular atomic materials,and make realization of inorganic non-metallic solid electrolyte materials ofsolid state reaction of glass(Function of conductive ceramics) and metal alloysto achieve connection.Analysis of the electrostatic field bonding connection mechanism, thestrong electrostatic field and temperature field under the conditions of the energyto interrupt the ionic bond, the release of free alkali metal ion, ion migration andelectrochemical reaction bonding connection.Glass-ceramic has the toughness ofhigh strength characteristics than traditional glass, so this article uses glassinstead of the traditional glass-ceramic and aluminum Anodic bonding, andbetter characteristics of micro-components, improving the quality and strengthof the bonding connection.And adopt common anode Anodic bonding technology of glass-ceramicswith aluminum foil for the key test,optical instruments such as SEM, XRD,metallographic microscope specimen observation of microstructure of bondingsuccess. Make a detailed analysis of migration of ions on the electrostaticbonding process bonding reaction interface, the electrostatic force distributionlaw, bonding the transition to penetrate the area variation characteristics.In-depth research on electrostatic microstructure morphology of multilayerbonding characteristics and electrochemical reaction in new product distributionlaw in the transition layer, Further discussion on the Interfacial polarisation,interface structure and ion transport mechanism, finally summary bondingtheory that ormation of electrostatic ion migration mechanism of dynamicmultilaye.Glass-ceramic has the dual characteristics of the traditional glass andceramic, the adjustable range of the coefficient of thermal expansion, hightoughness than ordinary glass as the bonding material is better than conventionalglass. The experiments show that at a temperature of350℃~450℃Voltage 350~550V, glass-ceramic/aluminum foil/glass-ceramic bonding high quality.Electrostatic bonding process under an electric field migrate to the surface ofglass-ceramics of Na~+, Li~+and other alkali metal ions and oxygen in the air aseries of chemical reactions in high temperature environment, and finallygenerate the alkali metal salts to prove that the alkali metal ions migration underthe electric field is real. The tensile test showed that the fracture occurred in thebody of the glass substrate, which shows that the use of public anode canachieve a high strength connection.The results show that the glass-ceramic and aluminum electrostatic bondingcan achieve better connection effect has important implications for MEMS toimprove packaging technology.