Rresearch On Properties Of Superfine AIN/Epoxy Resin Composite Material

With the increasing of running speed and packaging density of microelectronics,the impact of the electronic packaging materials on circuit performance and speedbecome increasingly obvious. To meet the needs of this package, the package materialshould have low dielectric constant and high thermal conductivity. The traditionalpolymer electronic packaging materials such as epoxy thermal conductivity have lowthermal conductivity and are crisp.With the integration of integrated, fine of production,Miniaturization of chip and increase of package speeds, it become key to studyexcellent resistance thermal insulation and high thermal conductivity rate of thepolymer.In order to improve the thermal conductivity of the epoxy, we can get the epoxycomposites though adding aluminum nitride with high thermal conductivity and usingmechanical stirring. Due to the improvement of the thermal conductivity of compositematerials not only related to the filler content but also related to the interface of thematrix and the filler. This paper primarily studies the relationship of the aluminumnitride content and the performance of the composite. At the same time, the relationshipof silane coupling agent content and the binding capacity of aluminum nitride filler andepoxy matrix interface also is studied.Though testing the the thermal conductivity of the different proportions compositesby Steady state method. We can see the aluminum nitride particles can greatly increasethe thermal conductivity of composite materials, particularly, When the filler content issmall, the contribution of the thermal conductivity of the composite is polymermolecular chain vibration, the thermal conductivity is only0.4W/m. K, when the fillercontent increases, it can form a thermal conductivity of "network", when the content is50%, the thermal conductivity is only0.787W/m. KWhen the filler content increase again，the contribution of the filler and interface occupyan leading position. The better interface combined is, the higher the thermal conductivity is.When the When the content of coupling agent is4%and aluminum nitride content is50%,the thermal conductivity of the composites can reach1.222W/m. K.Aluminum nitride particles modified by the coupling agent can improve thebending strength of the composites, when the content of coupling agent is4%, theflexural strength is better than the effect of the other proportion. Though anglicizing the fracture morphology of the material, we can see that When the fracture morphology ofthe material is fine and dense rivers, small plane steps is much, the flexural strength ishigh.Using X-ray diffraction analysis, the article also analysis the interfacial bonding ofthe aluminum nitride particles and epoxy matrix. We can see that When the silanecoupling agent content is4%, the interlinear crystal spacing of aluminum nitrideparticles are relatively large, this is because the the interfacial bonding of the aluminumnitride particles and the epoxy matrix is good, So when the composite generate internalstress resulting from curing shrinkage, the aluminum nitride particles suffer relativelylarge tensile stress from the epoxy matrix,so it is forced to expand, when the interfacialbonding of the aluminum nitride particles and epoxy matrix is poor, the tensile stresswill decrease, and the expanding is small, so the interplanar crystal spacing is small.The electrical properties of materials also is tested, the dielectric constant increaseswhen the AlN content increases. When the AlN content is50%, the dielectric constantof materials is8.51, the volume resistivity is2.13×10¹⁴·m which meet the insulationrequirements. In summary, when the content of coupling agent is4%, the content ofmodified aluminum nitride is30%, the applicable value and economic value of thecomposite is the best.