Synthesis Of Bisphenol-AP Epoxy Acrylate And Study On Its Use In Stereolithography

Stereo Lithography(SL)is one of the manufacturing technologies and develops rapidly in the world manufacturing.Compared with the traditional manufacturing technology,it has lots of advantages such as low energy consumption,low pollution,highly effective production and so on.SL is a method of additive manufacturing that enables the construction of 3D objects based upon a digital model.Curing rate and accuracy of cured products are the significant standards in SL.But unfortunately it could not improve the two standards at the same time.The heat generation that increases with the increase of curing rate could lead to the softened even warped deformation of cured resins,which influences the final accuracy of cured products seriously.But the illumination intensity must been weakened in order to decrease the heat generation,which will make the curing rate slow down and increase the manufacturing cost caused by prolonging the manufacturing.Consequently,it is important to find a balance between curing rate and the accuracy of cured products.In this study,we aim at researching a curable resin with high glass transition temperature after curing.Bisphenol-A epoxy acrylate(DAC)resin has been the most commonly and widely used curing resins oligomer for its excellent performance such as high rigidity,strength,thermal stability and chemical resistance,wide source of raw materials,low cost and simple synthesis process.Bisphenol-AP epoxy acrylate(DAPC)resin which has a similar structure to DAC is a kind of second-degree functional liquid epoxy acrylate resin.Due to the rigid benzene ring,the cured products of DAPC have high strength and good thermal stability that will dramatically reduce the softened and warped of the cured resins caused by exothermic in the curing process.In this study,we used the 4,4'-(1-Phenylethylidene)biphenol(DAP)as material raw to synthesize bisphenol-AP epoxy resin(DGEBAP).The epoxy groups and phenolic hydroxyl optimal feeding rate is 10:1.The epoxy value(EV)is 0.4821 which is the 96.9%of theoretical epoxy value.Then,the bisphenol-AP epoxy acrylate resin was synthesized by esterification from the DGEBAP and acrylic acid.The best esterification temperature was 105?.The polymerization inhibitor was 4-methoxyphenol and its dosage was lwt%.The effect of ratio of oligomers and reactive diluents,illumination intensity and contain of photoinitiator to the free radical photosensitive resin and the effect of ratio of radical oligomers and cationic oligomers and contain of photoinitiator to the hybrid photosensitive resin on mechanical property and thermal properties by means of analyzing gel yield,thermo stability,glass-transition temperature and FT-IR.