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The Design Of A Special Wire Saw Slicing Large-size KDP Crystal

Posted on:2013-09-02Degree:MasterType:Thesis
Country:ChinaCandidate:Q C ZhaoFull Text:PDF
GTID:2231330374981787Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
As an important kind of nonlinear optical components, KDP(chemical formular KH2PO4)crystal which is widely used in the laser field. At present, slicing as the first step of the KDP crystal processing usually uses the circular diamond band sawing. But the circular diamond band sawing has many problems:too big cut seam brings too much serious waste; the saw blade appears corrugated easily; the abrasives wear unevenly; the band saw deviates in the cutting process which generates additional forces and makes the KDP crystal crack etc. While the wire sawing has flexible saw wire which brings no additional forces, small stress and low temperature in the cutting process, and the depth of surface damage is shallow, all of these advantages make it suitable for wafer cutting. And this wire sawing technology has been widely used in the slicing of the hard-brittle crystals such as single crystal silicon and SiC.Solve the problem which is caused by the looped diamond band saw in the processing of the KDP crystal by designing a wire saw in this thesis. The design of the wire saw includes:(1) According with the requirement of the KDP crystal slice, firstly, determined the process method and cut parameter by analyzing the process of the wire saw; secondly, determined the layout of the wire saw by analyzing and distributing the motion of the wire saw; machine tools; thirdly, selected the transmission form of the wire saw which ensured the achievement of the motion and the relative motion of the executives; Finally, selected the load-bearing structure form of the wire saw which made the ability resisting deformation of the wire saw meet the requirement.(2) According with the overall program of the wire saw, firstly, using the idea of modular design, the wire saw was divided into several modules from the perspective of functional analysis; secondly, designed the guide wheel module of the wire saw, including:the structural design of the guide wheel, the structural design of the guide wheel axle components, the structural design of the device adjusting the space of the guide wheel, the structural design of the device tensing the saw wire; thirdly, designed the feed motion module of the wire saw, including:the structural design of the workbench, the design and calculation of the guide rail, the design and calculation of the ball screw, the selection of the external device of the ball screw and the selection of the servo motor. (3) Firstly, designed the structure of the roller and the roller shaft; secondly, designed the structure of the support parts of the roller shaft, including:the structural design of the fixed side and support side support parts; thirdly, designed and calculated the guide rail and the ball screw, including:the design and calculation of the guide rail and the ball screw and the fastness of the track and slider; finally, designed and calculated the servo motor, including:the selection of the servo and the structural design of the connection of the servo motor and the screw shaft.(4) Firstly, designed the structure of the load-bearing module, including:the structure design of the base and rack; secondly, integrated the modules and drew out of the3D assembly drawings of the wire saw by using the draw software.
Keywords/Search Tags:KDP crystal, Slicing, Wire saw, Scheme design, Structure design
PDF Full Text Request
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