Research On Bonding Method Between Carbon Nanotubes And Cooper

Carbon Nanotube (CNTs), as a potential nano-material, is attracting extensive focus dueto its excellent mechanical, thermal, and electrical property since its discovery in1990s. As aresult, the researches on application of CNTs in microelectronic realm are keeping heated.The interconnection between the CNT and other metal is the key technique barrier, however,the researches on CNTs bonding method are still staying on level of laboratory, which canonly accomplish the bonding between metal material and single carbon nanotube or CNTs insmall quantity, meanwhile coming up with the drawback high cost, low efficiency, andunsatisfactory success rate. Due to the problems mentioned above, the CNTs cannot be widelyused in industry. So the solution of how CNT can be applied in mass and high efficiency hasbecome the limitation that restrains its industrial application.This thesis focuses on the bonding method between the CNTs and metal cooper becausethat cooper is a very common bonding material that is used in the semiconductor industry.The contents and innovations of this article are shown below:Firstly, researches on the bonding method between the CNTs and the cooper are doneaccording to the different conditions of CNTs, including the horizontally aligned CNTs aswell as the vertical aligned CNT (VACNT) array. As to the VACNT, researches andcomparisons on experiments are conducted with thermocompression bonding method and thevacuum inductive heat bonding.Secondly, optimize the equipment for thermocompression and induction heating binding.SiO2heat insulation layer is proposed based on the experiments, and promotes the formerCNTs horizontal bonding process.To summarize, this thesis provide a solution for the bonding method between the cooperand CNTs in various conditions.