Research On Elid Grinding Mechanism And Technique For Monocrystalline Silicon

In the precision grinding process, grinding wheel is easily to became dull off and be adhered at the surface by the chips, that affect the efficiency of materials processing and surface quality. How to make the grinding wheel kept sharp is one of the key factor to solve the problem of the grinding some hard and brittle materials such as monocrystalline silicon, ceramics, optical glass, sapphire, tungsten carbide etc. Electrolytic In-process dressing (ELID) grinding technnique is a precision machining method, which can get the mirror ground surface for hard and brittle materials.At present, ELID grinding technique mainly uses metal-resin bonded grinding wheels, however, it exists many problems, such as making difficultly, costly, and likely to cause pollution to the clean surface of functional materials. Therefore, this thesis adopts environmentally friendly Bamboo-Charcoal-Bonded (BCB) grinding wheel to get the precision and efficiency grinding for monocrystalline sillicon, and try to find the grinding mechanism of silicon with ELID grinding, furthermore seek to get the none pollution ground workpiece surface of monocrystalline sillicon.The main work contents and results of this thesis are as follows:(1) Studying on the ELID grinding mechanism with BCB grinding wheel for hard and brittle materials, analyzing theoretically of the tangential grinding force, introduced the measuring methods and set up a measuring instrument of grinding force.(2) cariied out the experiment studies with different grinding parameters (electrolysis voltage, duty cycle, grinding depth ap, the feed speed vw. and wheel speed vs) which impacts on the ground surface quality, tangential grinding force, grinding ratio for ELID grinding of monocrystalline silicon..(3) Using a genetic algorithm to optimize BP artificial neural network technology, forecasting ELID grinding results, determining the optimal process parameters of the BCB grinding wheel for ELID grinding of silicon. Finally the ground surface roughness of Ra can reach to0.026～0.028μm with W10abrasive grinding wheel for ELID grinding of silicon, the precision and efficiency grinding for silicon was achieved.(4) based on detecting and analyzing ground silicon surface by means of optical microscopy, scanning electron microscopy, high-resolution transmission electron microscope, X-ray photoelectron spectroscopy (XPS) etc. testing equipments, the test results show that the ground surface quality of monocrystalline silicon with ELID grinding using BCB wheel is better than metal bonded diamond grinding wheel, and none-polution ground surface for monocrystalline silicon was got by using of the BCB grinding wheel.