Research On Halogen-free And Non-phosphorus Flame-retardant Materials Used In The Substrate Material Of CCL

With the enhancement of the environmental and health awareness and theincreasingly increment of market demand for environmentally friendly products,the development and utilization of environment-friendly flame retardant copperclad board substrate material has become an important subject for both contemp-orary industrial and scientific researchers. Therefore, the development of halogenand phosphorus free environment-friendly laminate substrate materials is themain direction of studying on copper-based flame retardant material.The triazine ring structure with high nitrogen is introduced into the benzoxa-zine resin to improve the benzoxazine resin flame retardant. New benzoxazineresin was synthesized under solvent-free conditions from bisphenol A, formalde-hyde and melamine and the synthesis technology of benzoxazine resin wasstudied. The result showed that the optimum technological conditions of benzox-azine resin as follows: the molar ratio of formaldehyde, melamine and bisphenolA is1:8:0.5and reaction temperature is100℃and the reaction time is240min.The structures of nitrogen-containing benzoxazine resin were characterized by IRspectra and the softening point, solubility was studied.In this paper, a new halogen-free and non-phosphorus flame retardant lamin-ate substrate material was successfully prepared as follow: firstly the self-madebenzoxazine resin and epoxy resin （E-51） were blended, then the blend resinsystem, as matrix resin, was used to impregnate glass fiber cloth to prepare thelaminate material. The best content of E-51in impregnated plastic and the integr-ated performance of the plate obtained by using this impregnated plastic wasstudied. We also studied on the flame retardant magnesium hydroxide that impact comprehensive performance on the copper clad laminate substrate material. Res-ults indicated that the prepared halogen-free and phosphorus-free flame retardantcopper clad laminate substrate material have good comprehensive performance.When the E-51content is65wt%, the surface electric resistance of substratematerial is9.3×10¹² and the volume electric resistivity is7.79×10¹³Ω m.The relative dielectric constant is5.30and loss tangent is0.008, with gooddielectric properties. Flexural strength is518.0MPa and the oxygen index is36.5.Moreover, the plate also has good thermal stability with the thermaldecomposition temperature of plate is399.3°C and impregnated rubber has goodstorage stability. Adding different types of magnesium hydroxide powder（YX105, GX105, GX110）and different contains to substrate material whichepoxy resin （E-51） accounted for65wt%, the impact of board performances wasstudied through three different types of magnesium hydroxide. The resultsshowed that when magnesium hydroxide （YX105） content is10%, the board hasgood overall performance and the volume resistivity substrate material, surfaceresistance, the relative dielectric constant, loss tangent, bending strength andoxygen index are1.62×10¹⁴Ω m,8.6×10¹²Ω,5.33,0.008,512.0MPa and37.5,respectively.