Study On The Integrated Vertical Interconnection

With the development of the Large Scale Integrated Circuit technology and packaging interconnection technology, the2D-MCM in present day has been not fulfilled the application of latest’s communication system and Microwave or Millimeter-wave radar system. Due to the miniaturized size and lower weight,3D-MCM has been widely studied all over the world. As one of the important ways to conduct the3D-MCM, vertical interconnection has became very meaningful to study.This paper is focused on the vertical interconnection technology. Firstly, the Multi-chip module development status is introduced. Then the microwave transmission line principal and the fundamental theory of MCM are briefly discussed. The different technologies and structures to conduct vertical interconnection are introduced and compared among them. After considering, a novel coaxial-typed non-touched vertical interconnection module with the fundamental of the left-handed transmission line is proposed in this paper. This module has the smaller size, reliable connection and can be conducted massively compared the others structure. This3D-MCM is designed in K-Band. Simulation results showed than this module had the performance of low insertion loss and good impendence match. After fulfilled the ability to control size error of suppliers within China, the proposed vertical interconnection module is fabricated and tested. The test results have been verified by comparing with measurements. Due to the trade-off has been taken among circuit design, production process and module structure, this vertical interconnection can be widely used in3D-MCM application.To further miniature the size of vertical interconnection in a3D-MCM module, based on the coaxial-typed non-touched vertical interconnection module with the fundamental of the left-handed transmission line, a novel no-solder and non-touched vertical interconnection module is designed in this paper. The LTCC technology structure is used in this improved vertical interconnection. And the insulator in first vertical interconnection has been replaced by the metal via hole, which can be formed a coaxial line. Simulation results showed the improved module fulfill the performance of insertion and impendence match. So the size of vertical interconnection module is become smaller.