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Miniaturization Millimeter-wave Transceiver Module Based On Ltcc Research

Posted on:2013-02-24Degree:MasterType:Thesis
Country:ChinaCandidate:B HeFull Text:PDF
GTID:2248330374986457Subject:Electronic and communication engineering
Abstract/Summary:PDF Full Text Request
Millimeter-wave transceiver modules are widely used in civilian communication equipment and military equipment. It is technically difficult for the miniaturization of millimeter-wave transceiver modules. This thesis focuses on the Low Temperature Co-firing Ceramic technology (LTCC) which is an effective way for miniaturization design of millimeter-wave transceiver module. LTCC technology can realize the integrated circuit design of millimeter wave components, the passive components will be mounted inside the substrate, and the active chips can be integrated installation of the circuit board surface or mounted in the internal cavity. With the introduction of LTCC technology, designers can reduce the component’s weight and size, and improve the overall adaptability to environment and enhance the performance of the millimeter waves system.First of all, the millimeter-wave characteristics and the development trends of the miniaturization of LTCC components are presented in this thesis. In the second, in terms of requirements of specification, the theory diagram of the whole project is proposed. According to the demand of miniaturization, LTCC technology is introduced to this project. Then, the architectures of this project are designed and the analysis on the feasibility of each link is made. After that, combining with the actual requirements of this project, the design criteria are confirmed from the selected manufacturer after the introduction of the processing flow of LTCC technology. The key technologies in LTCC design is investigated and simulated in the development software environment of HFSS and ADS, such as the transmission line, interconnection, power divider, filter, transition and radio detector. For the importance of some structures, processing and testing sample is made. Also, the low frequency part circuit of this project is successfully designed at the same time.Finally, the key assembly technology of LTCC is investigated. The whole volume of the finished product is only70x50x14mm3. The test results show that the design of this project meets the expected requirements of specification. The author has accumulated a wealth of valuable experience for the design of millimeter-wave transceiver modules based on LTCC technology in the future.
Keywords/Search Tags:LTCC, millimeter-wave, miniaturization, transceiver module
PDF Full Text Request
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