Based On The Chip Assembly Ka-band Phased Array Receiving Component

The phased array radar is a new radar system with features of multi-function, multi-target, high-precision, anti-clutter and anti-jamming performance, it has incomparable advantages compared with the traditional mechanical radar. Transmit/receive (T/R) Component is the core of the active phased array radar, and each active phased array radar consists of large numbers of T/R modules. The cost of T/R module almost accounts for more than half of the entire cost of phased array radar, each of the indicators has a direct impact on the radar machine indicators, therefore, the study of the components is of great significance.The design is based on the Ka-band phased array receiver components with multi-chip assembly technology, since this design has a higher requirements of performance, size and weight, we choose GaAs MMIC chips, which possess the advantages of excellent performance, small size and light weight, the splitters used in the design is a self-designed ceramic film circuit, besides, we used the SIW transition substrate, which possesses the good performances of match and isolation, as the interconnection of each chip. The phased array receiver components achieve the interconnection between various devices with the technology of micro-assembly, and eventually volume of the receiving component of the phased is68mm x12mm x9.42mm, and the weight is less than20g. In this paper, we introduced the simulation design of splitters and SIW, the micro-chip bonding and gold wire bonding assembly technology in detail.The design successfully completed the simulation design and physical processing test of Ka-band phased array receiver components based on multi-chip assembly technology, and ultimately achieved a good performance within frequency of29.4GHz-31GHz.The gain of the overall system is over15dB, the noise figure is less than3.7dB, the input and output VSWR is both less than1.5, apparently all the above parameters meet the requirements.