Study Of Electroless Copperplating And Electroplating On ABS Resin Surface Modified By Heterocyclic Organosilane Self-assembled Film

Metallization of non-metallic plastics can make them enjoying the advantages of bothmetal and plastic, which is widely used in various technological fields such as the fabricationof printed circuits in microelectronics, arts and crafts, lamps, musical instruments, jewelryand so on. An appropriate etching system which can improve the adhesion is previouslyemployed for surface conditioning, as the surface roughness was increased. Up to date, thebest etching systems are chromic acid etching, potassium permanganate, H₂SO₄-MnO2,polymers grafting technique plasma modification and laser treatment and so on. However,these systems can cause a serious environmental problem and are complicated in thepretreatment process. So, a non-polluting and simple operation method should be found.In this paper, self-assembly and corona were used in the electroless copperplating.6-（3-（triethoxysilyl）propyl）amino-1,3,5-triazine-2,4-dithiol monosodium （TES） was used tofabricate self-assembled film on corona pretreated ABS surface which has hydroxy orcarboxyl（ABS-OH/ABS-COOH）. Then TES film modified ABS was treated by electrolesscopperplating and electrical copperplating. Orthogonal test was carried out to study theoptimal condition of the preparation of TES films, electroless copperplating and electricalcopperplating on ABS resin surface. And the optimal result compared with the bare ABSresin. The results are as followed:（1） By orthogonal test, the porous morphology appeared on the ABS surface modified byTES film, and the surface roughness increases, which was under the optimal conditionfor self-assembled film of TES concentration of3mmol/L, H₂O/CH3CH₂OH of10/90, pHof5.5, and hydrolysis24h under45℃, and cured of30min under80℃in the oven.（2） The electroless copper plating on the TES self-assembled film modified ABS resinsurface was studied. The bright, dense and uniform coating on ABS resin surface andgood adhesion property between ABS resin and copper plating wereobtained under the condition of1min corona discharge time,30minself-assembled time,10min electroless copperplating time, temperature of55°C⁶0°C and pH of13¹3.5. The plating rate and thickness were satisfied. And the SEM ofsaline test showed that the electroless copper on the bare ABS resin surface was peeledoff severely and copper film was loose, while the TES film modified ABS resin surface was uniform and not peeled off.（3） The condition of electrical copper was concentration of CuSO₄.5H₂O of133g/L, H₂SO₄of6.6ml/L³3.3ml/L, NaCl of53.3mg/L, current density of1.04A/dm²².08A/dm², time of10min⁶0min. And the ruling method of saline test showed the electrical copper on bareABS resin was peeled off of70%, while the TES film modified ABS resin surface wasnot peeled off.The excellent copper layer adhesion property with ABS resin was obtained by theelectroless copper plating on the self-assembled film modified ABS surface, which isessentially based on the formation of chemical bond between the-SH of TES and the copperlayer. The method of ABS pretreatment was efficient, simple and environment-friendly.