Research On The Technology Of Ceramic Surface Metallization

Ceramic/metal composite material not only has the characteristics of high temperaturestrength and good wear resistance but also has conductive and heat.In recent years, this newdeveloped material has extensive application prospects, so it received extensive attention athome and abroad. But the wettability between ceramic and metal is relatively poor, the perf-ormance and preparation is limited, so it is very important to improve the wettability betwe-en ceramic and metal. The purpose of this study is to prepare a layer of metal Ti coating onceramic surface,improve the wettability of ceramic and metal by modifying the surface of theceramic.Firstly，This study adopted the chemical vapor deposition method, using Ti powder andI2as precursor respectively, prepare to coat metal Ti on the basic surface of ceramic.Research the influence of the reaction precursor material quality ratio, deposition temperatur-e, deposition time on Ti coating.The results indicate:When precursors Ti: I2=1:3（massratio）, deposition temperature is1150℃, holding time is60min and the per unit area amo-unt of the Ti coating deposition of the ceramic samples reaches the maximum.The main coa-ting ingredient of the sample is Ti.Secondly，also this study focuses on the different activation processes adopt the methodof electroless plating copper on copper coating and the influence of different heat treatmenttemperature on the composition of Cu/Ti composite coating. The results indicate: The bestactivation process for electroless plating copper: CuSO441.5g/l, NiSO487.5g/l, NaH2PO4212g/l, the activation temperature is175℃. Whenthe temperature is800℃and900℃respectively, composite coating of Cu is mainly Cu and Ti₂Cu.When the temperature is1100℃,the main component of composite coating is low oxide of Ti and Ti3Cu3O.Finally, this study evaluates the wetting behavior between the ceramic coating andmetals by the sessile drop experiment. The results show that Ti coating can greatly improvethe wettability of ceramic and metal, the wettability between Al₂O₃ceramic and copper angledeclines from138°to57°.