The Studies On Chemical-Mechanical Polishing Solution Of SiO₂Sol

The competition of national power is rooted in the competition of advancedmanufacturing capacity in the21th century, which is mainly on the electronic industry. Now,the direction of the advanced electronics are high-accuracy, high performance, highintegration density and reliability, so it makes unprecedented demands on local or globalplaneness of surface. When the measurement of workpiece less than0.35μm,we must carrythrough to global planarization in the world. At the present time, CMP is equipped with theadvantages of chemical polishing and mechanical polishing, and it also the unique technologyfor global planarization. This paper mainly studies chemical-mechanical polishing solution ofSiO₂sol.First, we present the formula design of CMP solution, and make sure the maincomposition and function. Secondly, in the CMP solution,we use citric acid, phosphoric acid,oxalic acid, organic amine as pH modifier, we research different kinds of pH modifier anddifferent pH value impact on aluminum alloy surface in different polishing time. Than, weresearch the oxidant concentration impact on aluminum alloy surface, and analyse the surfacetopograpHy. In addition, I research the solid contend of SiO₂sol in the CMP solution impacton aluminum alloy surface. Finally, I research the pH value and different kinds of surfactantimpact on reliability of CMP solution.Through analyzing roughness, gloss, metallographic structure, surface chemicalelements of aluminum alloy surface and light transmittance of CMP solution, research showsthat CMP solution’s pH value, oxidant concentration, solid contend of SiO₂sol impact on thepolishing quality of aluminum alloy surface seriously. When adding organic amine A to CMPsolution, the pH value is buffered close to9.5, and polishing tiome is controlled to90minute, the polishing quality of aluminum alloy surface is improved significantly. On thisbasis, when oxidant concentration is0.06%, solid contend of SiO₂sol is42%in the CMPsolution, the polishing quality of aluminum alloy surface is best. The smaller the pH value ofCMP solution stray from the pH value of SiO₂sol, the better the reliability of CMP solution,and when using nonionic surfactant, the reliability of CMP solution is better.