Research On Ultrasonic Vibrator Of Fluid Jet Polishing And Applications

The paper makes reference to the research achievements of Jet polishing and chemicalmechanical polishing, as part of the research content of the national natural sciencefoundation item (No.51075195), a new method of fluid jet polishing driven by megahertzpiezoelectric vibrator is put forward and the method is used in silicon wafer’s chemicalmechanical polishing.This paper developed and produced a prototype of a jet polishing system of high rotatingspeed silicon wafer (non-contact) and low rotating speed polishing system (contact). Thepolishing method is verified by experiments of chemical mechanical polishing of siliconwafer. Using finite element software simulation to obtain the working mode of the ultrasonicpiezoelectric vibrator which are used in two sets of experimentation. The work modal andresonant frequency are verified by experimental test. The experimental results show that, forultrasonic fluid jet polishing, in the same experimental conditions, the relative speed betweensilicon wafer and jet current is higher, the effect of polishing is better. Effect of revolvingspeed to surface roughness of silicon wafer is more observable than polishing time. Thesurface damage of silicon wafer polished with this method could be avoided, so that thesilicon wafer dose not touch the polishing tools during polishing process. For ultrasonic fluidjet polishing containing polishing pad, in the same revolving speed, the polishing effect ofultrasonic spray apply polishing liquid is better than that of polishing liquid soak silicon wafer.Due to the effect of polishing pad, polishing time impact on the polishing effect of siliconwafer is more observable. In the two experiments polishing liquid can be recycled withoutcollecting and pressurization system, and obtain a better polishing effect.