Two Layer Flexible Copper Clad Laminated Method In The Preparation And Properties Of Polyimide

Polyimide(PI) is one of the high-performance polymer materials, which has a variety of ways in the synthesis, and can be processed in several ways. Flexible copper clad lamination (FCCL) prepared with PI has excellent comprehensive performance.ODPA-PDA-ODA polyimide acid, polyimide film and2-layer FCCL with two sides were prepared in present paper by the coating-lamination preparation via the conventional two-step thermal process. Mechanism of the lamination is analyzed. ODPA-BAPP-ODA polyimide acid, polyimide film and2-layer FCCL with two sides (or more than two sides) by lamination method via the conventional two-step thermal process. And the PI film and FCCL were characterized by Fourier transform infrared spectroscopy (FTIR), thermogravimetric(TG), differential scanning calorimetry (DSC) and X-ray diffraction (XRD),etc.The results showed that within the scope of the study, the incorporation of PDA into the ODPA-ODA system can effectively improve the mechanical properties and thermal stability, and the incorporation of BAPP effectively improves the bonding performance of flexible copper clad. ODPA-PDA-ODA type PI with20%PDA molar content is the best material for preparation of2layer flexible copper clad laminate with two swides by the coating-lamination preparation, with processing conditions of250℃,15Mpa and20min hot pressing. ODPA-BAPP-ODA type PI with40%BAPP molar content is the best material for preparation of2layer flexible copper clad laminate with two swides (or more than two sides) by the lamination preparation, with processing conditions of270℃,15Mpa and20min hot pressing. These two kinds of laminations meets the industrial requirements.