Preparation And Properties Of Composite Polyimide Films For The Application Of Flexible Copper Clad Laminate

With development of technology and improvement of the quality of people’slife,more requirements have been proposed to meet people’s need. Polyimides arewidely used in electronic products, satellite missile, automotive products and so on,because of its excellent performance, high temperature resistance, high strength andcorrosion resistance. Polyimides materials present any place from national defense todaily life.Electronic information products are getting shorter, smaller, lighter, thinner andmore beautiful, which raised the requirements of its circuit board. Flexible copperclad laminate (FCCL) is the essential materials of the production of flexible printedcircuit board, which is made of a flexible insulating base film and a copper foil. Theproduction process of FCCL has a great influence on the electronic products, which isthe core component of electronic products. By the production process, flexible circuitboards can be divided into three–story and two-story FCCL, The development ofthree–story FCCL production was processed early and was widely used, but due tothe presence of the adhesive layer, it was limited in use. As the heat resistance of theadhesive is not high, it is difficult to apply in the intensive heat capacity circuit;because of the poor dimensional stability of the adhesive, the rate of waster isimproved; because of the presence of the adhesive, the thickness of FCCL is increased.However, no floor plate and the adhesive layer exists in two-story FCCL,the twostory FCCL overcome the above drawbacks, it has better dimensional stability, betterheat resistance, better applicability for precision circuits and circuit density, which isdirection of development of FCCL.In this paper,we prepared thermoplastic polyimides and benzoxazole polyimidecomposite film,the high-performance composite films were synthesized for the flexible copper clad laminate floor (2-FCCL). The ether ketone type polyimides wasused as thermoplastic polyimides composited with benzoxazole polyimidecomposite,and we got composite film1and film2. The ether ketone polyimideadhesive lower layer and the copper foil, as the surface of the polyimidesbenzoxazole. This material combines the advantages of both the polyimides, theether bond is introduced to ensure that the one adhesive properties, resistance tobending, to ensure the introduction of a benzoxazole heat resistance, dimensionalstability, low moisture absorption, while the two type of polyimide has a lowdielectric constant and dielectric loss, and high surface resistivity. In addition,theelectrical performance of composites are excellent.The mechanical properties, thermal properties, dielectric properties of thecomposite membranes were characterized and the results indicate that the newpolyimides composite film has the advantages of both polyimide. The tensile modulusis above4.47GPa, the temperature of5%weight loss is above525℃and545℃inair and nitrogen respectively, referral dielectric constant (1MHZ) is less than3.42,moisture is less than1%.The two-story FCCL meet the requirements ofhigh-performance boards and will be wide used in electronic information industry.