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Study On Thermoplastic Polyimide (TPI) Used For Double-sided Flexible Copper Clad Laminate

Posted on:2019-03-29Degree:MasterType:Thesis
Country:ChinaCandidate:T C XingFull Text:PDF
GTID:2371330566486806Subject:Engineering
Abstract/Summary:PDF Full Text Request
Polyimide belongs to a kind of polymer.Its most prominent feature is the structure of the-CO-NH-CO-on the main chain.It has excellent thermal stability,mechanical properties,dielectric properties,and is widely applied in aerospace,machinery,automotive and microelectronics.In recent years,to meet the development needs of some special fields,thermoplastic polyimide(TPI)has become a hot topic in the field of high performance materials.TPI is machinable and heat-resistant,and can be used in the field of double-sided flexible copper clad laminate.In general,TPI can be prepared by introducing flexible structural units,large side groups and non-plane structures into the molecular chain of PI.My study uses ?-BPDA,s-BPDA as two anhydride monomer feedstock,ODA and TPE-R as two amine monomer raw materials.Different PAA solutions are prepared by changing the proportion of their delivery.When the PAA solution are disposed by thermal imidization method,they will change into different properties of TPI films.Then we can choose the excellent performance of the TPI by testing a series of characterization.To obtain the three layer polyimide composite film,the PAA solution is coated on both sides of the PI membrane.Next,we can selecte composite films with excellent performance by testing a series of characterization.Finally,the double faced flexible copper clad plate is prepared by the composite film and the test and characterization were carried out.In this paper,the performance of TPI films,the polyamic acid performance and the double-sided flexible copper clad laminate are characterized by Ubbelohde viscometer,infrared spectrometer(FTIR),thermogravimetric analysis(TG),differential scanning calorimetry(DSC),scanning electron microscopy(SEM),thermo mechanical analyzer(TMA),tester,and universal electronic tensile machine.The results show:By using DMF as solvent,?-BPDA and s-BPDA as mixed two anhydride,ODA and TPE-R as mixed two amines,PAA solution can be obtained.When the mole ratio of anhydride and amine is 1.05:1,the reaction temperature is 5? and the reaction time is 5h,PAA solution with good film formation can be obtained.When ?-BPDA: s-BPDA: ODA: TPE-R=5:5:7:3,the prepared TPI,TPI/PI/TPI three layer composite film and the double-sided flexible copper clad laminate have the best performance.When the pressing temperature is 360 ?,the pressing time is 60 s,and the compression pressure is 15 MPa,the performance of the double-sided flexible copper clad laminate is the best.
Keywords/Search Tags:PI, thermoplasticity, composite film, double-sided flexible copper clad laminate
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