| Epoxy Resin has a great of prominent characteristics, widely used in electronic components encapsulation, and printed circuit board, etc. Especially in the field of insulating laminate, the application rate of epoxy resin is second to none. Though there are many kinds of matrix resin for laminate, but the poor heat resistance and easy burning defects make the study of modified epoxy resin has become the hot spot.In this paper, the main raw material is epoxy resin D331. DB606is flame retardant. D-248is curing agent. The modified resin system with high performance has been obtained by copolymerization of halogen-free flame-retardant resin DBDD system. In the test, glass fiber fabric is regarded as reinforcing material, the modified resin system is regarded as matrix resin and toluene and acetone are regarded as mainly the reaction solvent, all of them can prepare the excellent stability glue and prepregs. The mechanical properties and electrical properties and heat resistance of the modified resins were studied, as well as the water absorption and density, all of which have a great directivity to the performance of the laminate. The mechanical properties, electrical properties, flame retardancy and heat resistance, water absorption, and density of laminates were studied. The finest resin system is settled down through experiment and analysis.Modified epoxy system has two peaks, the first is the main exothermic peak through DSC analysis. The main heat curing ranges between386.2K and516.0K, the peak top temperature is460.6K, and the enthalpy is180.0J/g. The surface energy is41.5mJ/m2, which is much less than the surface energy of water, it means a good hydrophobicity. Overall relative dielectric constant between4.23and4.29, which shows a good insulating property.Laminate has a good overall performance, which can meet all indicators. Excellent flame retardant can achieve V-0level, it has good mechanical properties, the normal bending strength can reach702MPa, and the high temperature bending strength can reach498MPa. High temperature flexural retention rate is71%.It also has good electrical properties, which electrical breakdown voltage reaches43kV. |
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