The Study And Simulation Of Multi-wire Key Issues

Solar power is the most effective way to solve the global energy crisis, the electronicinformation industry is the most powerful booster to change the way of life of humanity.Silicon wafer as the substrate components of the photovoltaic industry and the electronicinformation industry, traditional wafer cutting technology has been unable to meet itsproduction and quality requirements of the industry.With the large diameter, high productionrate, less kerf-loss, good surface quality, multi-wire cutter has occupied the mainstreammarket of wafer cutting. However, the technology of multi-wire cutting has been control inEurope, America Japan for many years. Therefore, we must study the key issues in multi-wirecutting and do the necessary finite element simulation, develop our own multi-wire cutting.Through the study of multi-wire cutting mechanism, the presence of hydrodynamiceffects in the cutting area, we believe that the material removal caused by sic repeatedcollisions silicon surface can not be ignored, and modeled the impact of an abrasive assaultsilicon surface. Using the finite element analysis software simulation of silicon crystal surfacestress arising from the impact of the round grains of different diameters, grains of differentshapes at the same speed. The results show that: under the same conditions, different sizes ofspherical particles caused significantly different impaction force for the target of siliconcrystal., the general rule is that the larger the particle size, the greater the impact force.Different shapes of abrasive can cause different maximum impact force to the target, the forcecaused by square abrasive is larger than the force caused by spherical grains. A large forceconducive to the removal of materials, so grains with sharp corners have a better cuttingefficiency than smooth grains.Diameter and vibration of the cutting line for the influence of cutting process has beenstudied, we also create a vibration model of the cutting line and study the prestressed modal of cutting line and the relationship of tension, speed and amplitudes. The following conclusions:A smaller diameter of cutting line can reduce the loss of material and reduce the designrequirements of the cutting machine;During the cutting process the cutting line maintaining ahigh tension and a faster speed can get a more stable and reliable cutting system, improvethe quality of the machined surface of the silicon wafer.