Research On Micro-nanometer Scale Materials’ Dynamic Mechanical Parameters Measuring Methods Based On High-speed Vision

Modulus and internal friction are two significant dynamic mechanical pa-rameters in material research, and internal friction is a direct reflection of defects in materials. Although modulus theory for micro-nanometer scale materials is comparative mature technology, traditional internal friction technology is only suitable for normal size solid state materials. The existing micro-nanometer scale materials internal friction measuring methods are of low accuracy and narrow frequency range, and cannot acquire internal friction frequency spectrum. This paper presents a non-contact method for dynamic mechanical parameters mea-suring based on high-speed vision with microscopical technology, it can measure modulus and internal friction of micro-nanometer scale materials. Experimental results show good effect, wide frequency range and great system expansibility.The main work and research are described as follows,(1) After analyzing the existing measuring methods for modulus and inter-nal friction of micro-nanometer scale material, this thesis proposed a parameters measuring method based on high speed vision according to related theory.(2) The hardware system and measurement scheme were designed to acquire the image sequence of fiber vibration using high speed vision, the fiber was ex-tracted and measured by image processing algorithm.(3) Low frequency and high frequency internal friction and other parameters are calculated by related numerical analysis algorithm.(4) Experimental results verified the validity of the measurement system, the method proposed can measure modulus and internal friction effectively.The innovations of this thesis’studies are as follows,(1)A new method for obtaining micro-nanometer scale materials’ dynamic mechanical parameters was proposed, it realized the measurement of modulus and internal friction in non-contact way by high-speed vision technology.(2)We use high-speed vision and microscopical technology to record whole vibration process for dynamic mechanical parameters analysis.