Technology Study Of Chemical Thick Nickel Plating On Epoxy

This paper reported the result of this project through the pretreatment before plating, nickel plating operation optimization, plating after testing three main steps. By the desiccant method calculated the plating thickness and the plating rate. Through scanning electron microscopy(SEM) observed the plating coating surface and cross-section. Row lattice method to test nickel layer on the substrate surface adhesion. The thickness of nickel plating reached 100 μm, and plating speed is smoothly, the plating solution shown better stability, plating surface and adhesion meet the requirements as well as.The purpose of the pretreatment before plating is mainly to make epoxy resin substrate surface having catalytic activity, so that the surface has the catalytic ability, being able to produce chemical plating reaction. Therefore, it has to be cleaned on the substrate, through oil removal operations(5 min), activation(10 min) and reduction(1 ~ 2 min) to expose the substrate surface catalytic center.By single factor experiment, nickel plating operation optimization for initial fluid formulation and process of thick nickel plating: nickel sulfate, 5 g / 200 ml; Sodium hypophosphite, 5.5 g / 200 ml; Citric acid sodium, 6 g / 200 ml; Ammonium sulfate, 6 g / 200 ml; The amount of stabilizer, 1 ml / 200 ml; Initial solution volume is 40 ml; temperature is 80 ℃ ±0.5 ℃; the pH value is around 9; after 40 min to add the plating solution, adding the concentration is twice of the initial solution concentration, and every 40 min filtering solution. Under the technological conditions above, the average velocity in the plating will reach to 19 μm/h, the time of plating is less than 6 h can make the coating thickness to 100 μm, and it solved the problem of stability of plating solution and the bubble problem on the surface of the coating at the same time, overcome the shortness of general chemical nickel plating liquid having short life.