Aerospace Electronic Devices Thermal Analysis And Thermal Testing Study

With the rapid development of the electronic industrial technology, electronicproducts have been used in various fields, such as military, communication, aerospace,civilian life and so on. The structure size of electronic components is becoming smallerand smaller. The power of electronic components is continuously increasing along withthe more and more complex functions. Highly integrated large-scale circuit is appliedmore and more widely. These all result in the heat flux increasing in highly integratedcircuits. That causes the high operating temperature of the electronic components andthermal failure. Currently, one of the bottlenecks restricting the further development ofthe electronic industrial technology is the thermal failure of electronic components. Tosolve the thermal failure of the electronic components better, electronic equipmentdesigners have been paying high attention to thermal control technology (thermalanalysis and thermal design). They have been developing and improving thesetechnologies continuously. For the special environmental condition and stringent designrequirement, the overheating problem of the electronic equipment is more outstandingin the field of aerospace, which makes electronic equipment cooling more difficult. Thispresents a huge challenge for thermal design engineers.The purpose of the thesis is to design and construct a ground vacuum thermal testexperiment system, conduct experimental study of aerospace electronic equipment, takeadvantage of the thermal test experimental data to verify and modify the thermalsimulation model of electronic equipment, master the correct thermal simulation ideaand method, lay the foundation for the subsequent thermal analysis and thermal designwork. The finite volume method and the max-min ant colony algorithm (MMAS) werealso studied and applied to thermal layout optimization design of the package chip onPCB. The specific work of this article includes the following three aspects:1、Designing and constructing the ground vacuum thermal test experimental system.To ensure the reliability of its performance in the space, electronic equipment on thespacecraft must pass through the thermal test on the ground. This thesis mainly studieshow to design and build a vacuum thermal test experimental system that canrealistically simulate the thermal environment where spacecraft electronic devices are as much as possible. The thermal test experimental system was utilized to do experimentalresearch on aerospace electronic equipment when its performance met the requirements.2、 Aerospace electronic equipment thermal simulation and thermal design.Introducing the basic theory of numerical heat transfer in the beginning, then giving abrief introduction of Icepak which is a thermal simulation software, and summarizingthe modeling method of electronic device components. With the above knowledge, thearticle conducted thermal simulation for the electronic equipment, and then comparedthermal simulation results with thermal test experimental data to verify the accuracy ofthe thermal simulation idea and method. The thermal simulation analysis for the realcircuit board of electronic equipment also was done, and the effects of different coolingmethods for package chip temperature on circuit board were studied. In the end, thearticle introduced the thermal resistance network model of the package chip, studiedhow to calculate the thermal resistance of double thermal resistance network model ofthe package chip, and verified the calculation accuracy of double thermal resistancenetwork model.3、The package chip thermal layout optimization design on PCB. Firstly, anintroduction to the basic principles of ant colony algorithm, mathematical model andalgorithm implementation process was given. The article also introduced the max-minant system (MMAS) improved characteristics in detail. The finite volume method andthe max-min ant system (MMAS) were applied to solve the package chip optimizationlayout on PCB. Both the positive and negative problems of package chip layout weresolved with the Fortran program. In the end, the article conducted the thermalsimulation to verify the package chip optimization layout by Icepak.