Structure Design And Physical Fields Simulation Of Cu-Al-Ti Assembled Armature

Most of existing solid armature is an integrated structure of aluminum and its alloy，the material composition and structure features of armature directly affect theelectromagnetic conversion in the process of electromagnetic launch and themulti-physics field of armature and system efficiency. Electromagnetic launch usuallyfinished in a few milliseconds and always accompanied by the interaction ofelectromagnetic,thermal and stress, during the launch armature exists a few questionswhich mainly include current and velocity skin effect, ablation caused by the local hightemperature, velocity transition and structure damage. By taking advantage of thenumerical simulation, this paper studies the the physical field of armature in the processof promoting.This paper mainly includes three aspects:1. Based on traditional Al based rectangular and Shaped-U solid armature structure,there are designs about Al based rectangular and Shaped-U solid armature with copperconductive sheet and conductive column structure and Cu-Al-Ti gradient assembledarmature, by changing materials and structures to solve the problem of currentconcentration, to make a more uniform current distribution and a more reasonabledistribution of electromagnetic field;2. Charging voltage,inductance gradient, equivalent circuit and other parametersapplied for numerical simulation of Al based assembled armature are determined. First,there is a comparison about magnetic field and current density distribution between thetraditional Al based armature and Al based rectangular and Shaped-U solid armature withcopper conductive sheet and conductive column structure, finding the effect of copperconductive sheet and column do not reach the design requirement. Then theelectromagnetic fields of different proportions of Cu-Al-Ti gradient assembled armatureare analyzed, with the result that the current and magnetic field concentrated distributionof Cu-Al-Ti gradient assembled armature can effectively improve by combinationstructure, avoiding the current skin effect. Finally, comparison of temperature field and stress field distribution between Cu-Al-Ti gradient assembled armature and traditional Albased armature are made, the simulation results indicate that the temperature field andstress field distribution of Cu-Al-Ti gradient assembled armature are more uniform thanthe traditional Al based armature, T-364Cu-Al-Ti gradient assembled armature isregarded as the final optimization of solid armature and is more reasonable than otherarmature’s structure.3. Lubrication component MoS2coating is introducing to T-364Cu-Al-Ti gradientassembled armature by different modes of distribution, attempting to further reduce thefriction energy loss and improving the efficiency of the system.Uniform distribution ofT-L4Cu-Al-Ti gradient assembled armature can exert the lubrication component’sfunction reducing friction loss and temperature rise in the greatest degree, as well as theelectromagnetic field’s uniform advantage brought by the assembled structure does notbe influenced, through the analysis of the electromagnetic field of different armatures.Atthe end the Cu-Al-Ti gradient assembled armature preparation process is described indetail.