Wafer Cleaning Ultrasonic Parameters Effect On Mechanism And Experimental Research

Ultrasonic cleaning is better than regular cleaning, especially for mechanicalcomponents with complicated surface pattern, such as pitted surface or with blindholes, or smaller products with critical demand in cleanliness, such as semi-conductorproducts, wafers, watches, precision parts, electron components and circuit boards.Ultrasonic cleaning has very ideal cleaning result for these parts.This article introduces influence mechanism of different parameter setting ofultrasonic wave on wafer cleaning, discuss factors, including theory of ultrasonicfacilities, ultrasonic frequency, influencing factors on ultrasonic cleaning, throughexperiments to find the suitable cleaning technology parameters. So as to solvecleaning issues and meet customer’s demand on cleanliness, which helps to achievemass production of wafers.In our production, cleaning defects such as white cloud、particle haze、cleaninghaze、scratch、photo-resist residue have great impact on quality, even cause loss ofwhole lot of products. In this article is to elaborate ultrasonic optimum parametersselection through the below three aspects.1. Systematically introduce the composition and theory of ultrasonic equipment2. Selection of ultrasonic frequency. Elaborate how ultrasonic wave andMegacoustic wave work.3. Summarize factors that affect ultrasonic wafer cleaning and noninvasiveultrasonic cleaning method.