A Study Of Export Packaging Design Method For Electronic Products

Electronic products are characterized by the delicate, easily damaged, and high value parts. Their improper packaging will cause a great loss in the process of logistics. Especially in the process of being sold abroad in that the distribution is more complex and the environment is more changeable, and every country has stricter requirements on imported products and packaging. For this reason, it’s a very important task to design the sound export packaging for electronic products via the scientific method. On the basis of the complete packaging concept, the thesis puts forward a method of export packaging design for electronic products by use of the finite element simulation technology and TOPS Pro logistics transportation optimization. And the packaging design of projector is used to verify the correctness and feasibility of the method.This thesis makes a deep study for overall packaging concept and designs export packaging for electronic products based on complete packaging solutions. In detail, it primarily uses an electronic product package as the research object and establishes the packaging model which is appropriately simplified by using 3D modeling software, Pro/Engineer. The thesis takes the projector packages for example and simulates the pressure, vibration and drop of product-package system via ANSYS to analyze packaging dynamic properties.In this thesis, the author investigates the stacking situation in the warehousing and transporting, and simulates its compressive forces in three different directions according to the corresponding national test standard. The author introduces in detail the entire simulation process such as modeling, pre-processing, post-processing and respective steps to which should be drawn attentions. The deformation and stress for the projector packaging while being pressed are analyzed. According to the vibration and shock in distribution, this thesis makes modal and drop simulation to product-packaging. Modal analysis can gain the natural vibration frequencies of the packaging and designers can optimize the packaging structure to get rid of the resonance during the transportation based on the modal analysis results. Meanwhile, the thesis also makes the drop simulation for projector and packaging system with the explicit dynamic module of ANSYS/LS-DYNA, explaining the study methods and steps of drop simulation, and acquires kinds of physical parameters of packaging like stress, strain and so on. This thesis analyzes and evaluates the protection performance of outer packaging to the inner product.Finally, by using of loading and optimization software, TOPS Pro, the thesis provides optimization and guidance to the packages’ transportation design and arrangement for export to improve the space utilization and reduce transportation cost.In this thesis, a reasonable and low-cost packaging design method is obtained by introducing the computer technology into the packaging design, which improves the efficiency of testing packaging properties and shortens the test cycle.