Numerical Simulation Of Water-cooled Radiator Cooling Electric Locomotive Electrical

Development of modern power electronic devices very rapidly, and its main development direction of high power density, high reliability, high efficiency, in order to achieve miniaturization and integration. Power electronic device is mainly composed of many electronic devices, such as the heat from the inverter, transformers, integrated circuits, high-power resistor, power transistor, the light emitting device having a resistive current-carrying other electronic device. Each electronic device has a certain temperature range, a sharp deterioration in reliability will be if the operating temperature range electronic device exceeded. If the temperature rise is too large, the mechanical strength of the electronic device will have a very important influence, such as chemical reaction of the metal oxide material, etc., or an insulating member so that the dielectric loss increases, accelerating the aging of the insulating member, and thus will affect the electronic performance of the device, or even a direct result of the failure of an electronic device. It can be seen that affect the reliability of electronic devices is the key to heating problems. And if the electronics fail, it may cause the entire system to stop running, resulting in very significant losses. Thus, limiting the temperature rise of heat generation of electronic devices, the electronic control device at a lower temperature is one of the key to improve the reliability of power electronics systems.The main topic of the electric locomotive traction converter IGBT electronic devices carried water cooling, the heat generated by power electronic devices work when the first water-cooled heat sink will spread on a substrate, followed by a water-cooled heat sink substrate to the heat generated by the heat transfer mode transfer to the radiator circulating water cooling cavity, and by the action of the cooling water pump, the forced circulation of hot water in the cavity to the outside of the water-cooled panel, and finally through the cooling fan will cycle to the external water-cooled panel for ventilation temperature water cooling by cooling water flows back to the water-cooled cavity plate to work.This cooling process is repeated as described above, so as to achieve the effect of heat, the heat generated by power electronic devices away.The issue is the use of computational fluid dynamics CFD method for locomotive traction converter cooling system used by the water-cooled heat sink substrate numerical simulation analysis, the first to use three-dimensional modeling software Pro/E model for water-cooled radiator substrate, and then import Icepak CFD meshing software, external conditions set and calculated analysis of results.